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Radiant will fabricate wafers for customers needing all or part of a ferroelectric capacitor process to complete their research. Our process flow is compatible with several MEMs processes and may be used to fabricate piezoelectric actuators and sensors or pyroelectric sensors on MEMs devices. The process flow is not suitable for wafers already containing high density CMOS circuitry. The process flow is as follows:
- Patterned platinum or LSCO bottom electrode
- PZT or PNZT capacitor ferroelectric
- Patterned platinum ot LSCO top electrode
- Interlayer Dielectric and Passivation
- Metalization
- Top Glass scratch protection
Radiant will executed individual process steps for you for research quantities of samples. A general list of the processes available at Radiant appears below:
- Thermal annealing
- Spin coat and contact photolithography
- Dicing
- Metal deposition by e-beam evaporation
- Fluorine plasma etch
- Deep RIE
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