Platonized Wafers • PZT Wafers • Foundry • Process Elements

Platinized Silicon Wafers

Thin titanium dioxide/platinum films for bottom electrodes deposited on four-inch silicon wafers. The platinum films can withstand up to 750 °C in oxygen for one hour with no roughening or hillock formation. Radiant will coat the electrode with 20/80 PZT or 4/20/80 PNZT if requested.
Specifications

Processes Available to Researchers at Radiant

In today’s world, it is difficult to find sources for one time process step execution such as metal deposition, thermal annealing, and so on. If you are building devices and need access to certain processes available at Radiant, contact Gerald Salazar at 505-348-4322. Radiant will executed individual process steps for you for research quantities of samples. A general list of the processes available at Radiant appears below:

-Thermal annealing
-Spin coat and contact photolithography
-Dicing
-Metal deposition by e-beam evaporation
-Fluorine plasma etch